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Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 5, 2012, Pages 1108-1115

Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes

(6) Han, Y D a,b Jing, H Y a,b Na, S M L c Xu, L Y a,b Tan, C M a,b,d Wei, J a,b

a TIANJIN UNIVERSITY (China)

b TIANJIN KEY LABORATORY OF ADVANCED JOINING TECHNOLOGY (China)

c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

d NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CREEP BEHAVIOUR; CREEP STRAIN RATE; MAXIMUM LOAD; NANOCOMPOSITE SOLDER; NANOINDENTATION TESTS; ROOM TEMPERATURE; SN-AG-CU; SNAGCU SOLDER; SOLDER ALLOYS;

CARBON NANOTUBES; CREEP; NANOINDENTATION; POWDER METALLURGY; SOLDERING ALLOYS;

TIN;

EID: 84861929523 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0557-9 Document Type: Article

Times cited : (41)

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