Creep and fatigue behaviors of the lead-free Sn-Ag-Cu-Bi and Sn60Pb40 solder interconnections at elevated temperatures

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 6, 2007, Pages 665-670

  Zhang, X P ^a   Yu, C B ^a   Shrestha, S ^b   Dorn, L ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP FRACTURE; CREEP-ACTIVATION ENERGY; ELEVATION TEMPERATURES; SOLDER INTERCONNECTIONS;

ACTIVATION ENERGY; CREEP; FATIGUE OF MATERIALS; FRACTURE; SOLDERED JOINTS; SOLDERING ALLOYS; TEMPERATURE;

TIN ALLOYS;

EID: 34247115108     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9078-3     Document Type: Article

References (17)

1. N.C. Lee, Solder. Surf. Mount Technol. 9, 65 (1997)
2. M. Abtew, G. Selvaduray, Chip Scale Rev. 2, 29 (1998)
3. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, Lead-Free Soldering-An Analysis of the Current Status of Lead-Free Soldering, (UK Dept. of Trade & Industry Report, 1999) p. 1
4. K. Suganuma, Curr. Opin. Solid. State Mater. Sci. 5, 55 (2001)
5. K.N. Tu, A.M. Gusak, M. Li, J. Appl. Phys. 93, 1335 (2003)
6. A. Hirose, H. Yanagawa, E. Ide, K.F. Kobayashi, Sci. Technol. Adv. Mater. 5, 267 (2004)
7. H. John, L. Pang, B.S. Xiong, T.H. Low, Creep and Fatigue Characterization of Lead Free 95.5Sn-3.8Ag-0.7Cu Solder, Electronic Components and Technology Conference, (2004), p. 1333
8. C.M.L. Wu, M.L.L. Huang, IEEE Trans. Adv. Packag. 28, 128 (2005)
9. Zs. Illyefalvi-Vitez, J. Pinkola, G. Harsanyi, Cs. Dominkovics, B. Illes, L. Tersztyanszky, Present Status of Transition to Pb-Free Soldering, Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar, 19-20, 88 May 2005
10. U.R. Kattner, W.J. Boettinger, J. Electron. Mater. 23, 603 (1994)
11. X.P. Zhang, H.W. Wang, Y.W. Shi, J. Mater. Sci. - Mater. Electron. 15, 511 (2004)
12. A. Schubert, H. Walter, R. Dudek, B. Michel, G. Lefranc, J. Otto, G. Mitic, Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders, Proceedings of International Symposium and Exhibition on Advanced Packaging Materials, Braselton, Georgia, USA, 11-14 March 2001, p. 129
13. R. Darveaux, K. Banerji, A. Mawer, G. Dody In: J.H. Lau (ed.), (Ball Grid Array Technology, McGraw-Hill, Newyork, 1995), p. 379
14. J. Cadek Material Science Monographs, (Elsevier, Amsterdam, 1988)
15. S. Wiese, A. Schubert, H. Walter, R. Dudek, F. Feustel, E. Meusel, B.Michel, Constitutive behavior of lead-free solders vs lead-containing solders-Experiments on bulk specimens and flip-chip joints, Proceedings of 51st Electronic Components and Technology Conference, Orlando, Florida, p. 890 (2001)
16. Q. Xiao, L. Nguyen, W.D. Armstrong, Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy, Proceedings of 54th Electronic Components and Technology Conference, (Las Vegas, Nevada, USA, 1-4 June 2004 vol.2), p. 1325
17. T.E. Homa, Cracking of electronic packaging joints due to creep-fatigue, Proceedings of ASM's 3rd Conference on Electronic Packaging and Corrosion in Microelectronics, (Minneapolis, Minnesota, 28-30 April 1987), p. 9