Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages

Microelectronics Reliability

Volumn 49, Issue 7, 2009, Pages 746-753

  Gain, Asit Kumar ^a   Chan, Y C ^a   Sharif, Ahmed ^b   Wong, N B ^a   Yung, Winco K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AG PARTICLES; BALL GRID ARRAY PACKAGES; COMPOSITE SOLDERS; DIMPLED SURFACES; DUCTILE FAILURES; FRACTURE SURFACES; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; REFLOW CYCLES; SCALLOP-SHAPED; SECOND PHASE; SMOOTH SURFACE; SN-9ZN SOLDER; SN-ZN SOLDER; SOLDER BALLS; TOP SURFACE; UNIFORM DISTRIBUTION;

BRAZING; BRITTLE FRACTURE; DUCTILE FRACTURE; NANOPARTICLES; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE STRENGTH; WELDING; ZINC;

TIN;

EID: 67649419538     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.05.004     Document Type: Article

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