Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints

Journal of Alloys and Compounds

Volumn 500, Issue 2, 2010, Pages 167-174

  Lin, Hsiu Jen ^a,b   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Au Ni Cu pads; BGA packages; Intermetallic compounds; Mechanical properties; Sn 3Ag 0.5Cu 0.5Ce 0.2Zn solder

Indexed keywords

BGA PACKAGE; BGA PACKAGES; GROWTH OF INTERMETALLICS; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE AND MECHANICAL PROPERTIES; RAPID GROWTH; SOLDER JOINTS; TIN WHISKER;

CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; CRYSTAL WHISKERS; MECHANICAL PROPERTIES; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH; THERMAL AGING; TIN ALLOYS; TITANIUM COMPOUNDS; ZINC;

TIN;

EID: 77954216350     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.03.233     Document Type: Article

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