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Volumn 86, Issue 11, 2009, Pages 2347-2353
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Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages
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Author keywords
Ball grid array solder joints; Microstructure; Shearing force
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Indexed keywords
BALL GRID ARRAY PACKAGES;
BALL GRID ARRAY SOLDER JOINTS;
CU ADDITION;
CU CONTENT;
DIMPLED SURFACES;
DUCTILE BEHAVIOR;
FRACTURE SURFACES;
INTERMETALLIC COMPOUND LAYER;
INTERMETALLIC COMPOUNDS;
LAYER THICKNESS;
MATRIX;
REFLOW CYCLES;
RICH PHASE;
SCALLOP-SHAPED;
SHEAR LOADS;
SHEARING FORCE;
SN-3.5AG;
SN-9ZN SOLDER;
SN-AG-CU;
SN-ZN SOLDER;
STRUCTURE AND PROPERTIES;
TOP SURFACE;
WEIGHT PERCENTAGES;
BALL GRID ARRAYS;
BRAZING;
BRITTLE FRACTURE;
COPPER POWDER METALLURGY;
DUCTILE FRACTURE;
HYDROGEN EMBRITTLEMENT;
MICROSTRUCTURE;
PHASE INTERFACES;
POWDERS;
SEMICONDUCTING INTERMETALLICS;
SHEARING;
SILVER;
SILVER ALLOYS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
TIN ALLOYS;
WELDING;
ZINC;
TIN;
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EID: 69549089929
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2009.04.015 Document Type: Article |
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Times cited : (29)
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References (21)
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