SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 1, 2011, Pages 71-77

Effects of Ce addition on the microstructure and mechanical properties of Sn-58Bi solder joints

(2) Chuang, Tung Han a Wu, Hsing Fei a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

BGA packages; intermetallic compounds; mechanical properties; Sn 58Bi 0.5Ce; tin whiskers

Indexed keywords

BALL GRID ARRAY PACKAGES; BALL SHEAR STRENGTH; BALL-SHEAR TEST; BGA PACKAGE; CE ADDITION; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; MICROSTRUCTURE AND MECHANICAL PROPERTIES; SN-58BI-0.5CE; SOLDER BALLS; SOLDER JOINTS; TIN WHISKER; TIN WHISKERS; WHISKER GROWTH;

BISMUTH COMPOUNDS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; CRYSTAL WHISKERS; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; PACKAGING; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; SPHERES; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS;

TIN;

BISMUTH COMPOUNDS; CERIUM COMPOUNDS; JOINTS; MECHANICAL PROPERTIES; MICROSTRUCTURE; PACKAGES; RARE EARTH COMPOUNDS; SHEAR STRENGTH; WHISKERING;

EID: 78650734637 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1385-z Document Type: Article

Times cited : (44)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.