Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints

Intermetallics

Volumn 22, Issue , 2012, Pages 1-6

  Othman, R ^a   Binh, D N ^a   Ismail, A B ^a   Long, B D ^a   Ariga, T ^b  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b TOKAI UNIVERSITY   (Japan)

Author keywords

A. Intermetallics; B. Diffusion; B. Phase identification; D. Phase interfaces; F. Electron microscopy, scanning

Indexed keywords

ANODE SIDE; CU SUBSTRATE; F. ELECTRON MICROSCOPY , SCANNING; GROWTH OF INTERMETALLICS; LEAD-FREE SOLDER ALLOY; PHASE IDENTIFICATION; SN-8ZN-3BI; SOLDER JOINTS; TESTING CONDITIONS;

BISMUTH COMPOUNDS; COPPER ALLOYS; CURRENT DENSITY; INTERMETALLICS; LEAD COMPOUNDS; MICROSTRUCTURE; PHASE INTERFACES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; ZINC;

TIN;

EID: 82055200133     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2011.10.011     Document Type: Article

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