Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Scripta Materialia

Volumn 60, Issue 4, 2009, Pages 257-260

  Kang, Han Byul ^a   Bae, Jee Hwan ^a   Lee, Jae Wook ^a   Park, Min Ho ^a   Lee, Young Chul ^a   Yoon, Jeong Won ^a   Jung, Seung Boo ^a   Yang, Cheol Woong ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Heat treatment; Soldering; Transmission electron microscopy

Indexed keywords

BRAZING; COPPER; ELECTROLESS PLATING; HEAT TREATING FURNACES; HEAT TREATMENT; INTERMETALLICS; MICROSCOPIC EXAMINATION; NICKEL; NICKEL ALLOYS; SILVER; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; WELDING;

CU SUBSTRATES; ELECTROLESS NI; ELECTROLESS NICKELS; HEAT TREATING; INTERFACIAL REACTION LAYERS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; MECHANICAL RELIABILITIES; REACTION LAYERS; SOLDER JOINTS;

TIN;

EID: 56249141086     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.10.017     Document Type: Article

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