Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultrathin device

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 935-943

  Zhang, Xiaowu ^a   Rajoo, Ranjan ^a   Selvanayagam, Cheryl S ^a   Kumar, Aditya ^a   Rao, Vempati Srinivasa ^a   Khan, Navas ^a   Kripesh, Vaidyanathan ^a   Lau, John H ^a   Kwong, Dim Lee ^a   Sundaram, Venky ^b   Tummala, Rao R ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Drop impact test; Piezoresistive stress sensors; stress measurement; ultrathin device packaging and assembly; wafer bumping and handling

Indexed keywords

CHIP-LEVEL; DEVICE PACKAGING; DEVICE WAFERS; DIE CRACKING; DROP IMPACT; DROP TEST; ELECTRONIC PACKAGE; GROWING DEMAND; HAND HELD DEVICE; IN-PLANE STRESS; P-TYPE; PACKAGING PROCESS; PB FREE SOLDERS; PIEZORESISTIVE COEFFICIENTS; PIEZORESISTIVE STRESS SENSORS; PROCESS SELECTION; SILICON DEVICES; SOLDER BUMPING; STRESS EVALUATIONS; ULTRA-THIN; UNDER BUMP METALLIZATION; WAFER BUMPING;

DROPS; LEAD; SENSORS; SILICON WAFERS; SOLDERING; SOLDERING ALLOYS; STRESS MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 84861941580     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2192731     Document Type: Article

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