Stackable packages with integrated components

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 19-23

  Ostmann, A ^a   Neumann, A ^b   Jung, E ^a   Aschenbrenner, R ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LASER ABLATION;

BUILD-UP LAYERS; CHIP PACKAGES; ELECTROLESS NI; EMBEDDED CHIPS; INTEGRATED RESISTORS; LASER TECHNOLOGIES; ORGANIC SUBSTRATE; RELIABILITY TEST;

CHIP SCALE PACKAGES;

EID: 84954073018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271483     Document Type: Conference Paper

References (8)

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2. Owzar, K. Buschik, O. Ehrmann; M. Kasper; "RF-Investigation of the electrical parameters of the embedded chip structure", Proc. VLSI Packaging Workshop, Monterey USA, October 16-18, (1995).
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6. Ostmann, A. Neumann, S. Weser, E. Jung, L. Böttcher and H. Reichl , "Realization of a Stackable Package Using Chip in Polymer Technology", Polytronic Conference, June 23.-26. 2002, Zalaegerszeg, Hungary
7. A. Ostmann, A. Neumann, J. Auersperg, C. Ghahremani, G. Sommer, R. Aschenbrenner and H. Reichl, " Integration of Passive and Active Components into Build-Up Layers ", EPTC 2002.
8. A. Neumann, A. Ostmann, L. Böttcher and H. Reichl, "Reliability Tests of a Stackable 3D-Package", 14th European Microelectronics and Packaging Conference, Friedrichshafen, Germany, 23.-25. June 2003.