In-situ analysis of deformation and mechanical stress of packaged silicon dies with an array of hall plates

IEEE Sensors Journal

Volumn 11, Issue 11, 2011, Pages 2993-3000

  Husstedt, Hendrik ^a   Ausserlechner, Udo ^b   Kaltenbacher, Manfred ^a  

^a UNIVERSITY OF KLAGENFURT   (Austria)

^b INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

Author keywords

Deformation; Hall sensor; mechanical stress; packaging; sensor array

Indexed keywords

EXTERNAL FORCE; EXTERNAL MAGNETIC FIELD; EXTRA SENSORS; HALL PLATES; HALL SENSOR; IN-SITU ANALYSIS; MAGNETIC SENSITIVITY; MECHANICAL IMPACTS; MECHANICAL STRESS; NON-MAGNETIC MATERIALS; OPTICAL MEASUREMENT; PIEZO-HALL EFFECTS; PIEZO-RESISTIVE; PLASTIC PACKAGES; SILICON DIE; STRESS AND DEFORMATION; STRESS COMPONENT; TEST CHIPS;

DEFORMATION; DIES; HALL EFFECT; HALL EFFECT TRANSDUCERS; MAGNETIC FIELDS; OPTICAL DATA PROCESSING; PACKAGING; SENSOR ARRAYS;

STRESSES;

EID: 80055034671     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2011.2154326     Document Type: Article

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