LFBGA packaging stress measurements with piezoresistive sensors

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 482-487

  Lwo, Ben Je ^a   Tseng, Kun Fu ^b   Kao, Chin Hsing ^a   Chen, Tung Sheng ^a   Su, Jeng Shian ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; MICROELECTRONICS; MODIFIED ATMOSPHERE PACKAGING; PACKAGING; STRESS MEASUREMENT;

ENVIRONMENT TEMPERATURE; MICROELECTRONIC PACKAGING; PACKAGING INDUCED STRESS; PIEZO-RESISTIVE SENSORS; PIEZORESISTIVE STRESS SENSORS; TEMPERATURE INCREASE; TEMPERATURE STRESS; THERMO-MECHANICAL EFFECTS;

CHIP SCALE PACKAGES;

EID: 34548169786     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188887     Document Type: Conference Paper

References (11)

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