In situ analysis of the stress development during fabrication processes of micro-assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 117-124

  Pustan, David ^a   Rastiagaev, Eugen ^a   Wilde, Juergen ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE LAYERS; DIE ATTACHMENT; ELECTRONIC SPECKLE PATTERN INTERFEROMETRY; FABRICATION PROCESS; IN-SITU ANALYSIS; MEASURE IN SITU; MICROASSEMBLIES; PLASTIC ENCAPSULATION; SILICON CHIP; STRESS DEVELOPMENT; TEST CHIPS; WHITE-LIGHT INTERFEROMETRY;

ELECTRONICS PACKAGING; INTERFEROMETERS; INTERFEROMETRY; THERMAL STRESS; THERMOELASTICITY;

DIES;

EID: 70349655301     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074005     Document Type: Conference Paper

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