Thermo-mechanical stress analysis

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Niehoff, Katrin ^a   Schreier Alt, Thomas ^a   Schindler Saefkow, Florian ^a   Ansorge, Frank ^a   Kittel, Hartmut ^b  

^a FRAUNHOFER IZM   (Germany)

^b ROBERT BOSCH GMBH   (Germany)

Author keywords

CMOS test chip; Reliability; Stress measurement; Transfer molding

Indexed keywords

CHIP SURFACES; CMOS TEST CHIP; ELECTRONIC PARTS; ENCAPSULATION METHODS; EPOXY MOLDING COMPOUNDS; IN-PLANE NORMAL STRESS; IN-SITU; MATERIAL COMBINATION; MEASURING CELLS; MECHANICAL STRESS; MICROELECTRONIC PACKAGING; MOISTURE UPTAKE; NUMERICAL SIMULATION; PACKAGING PROCESS; PRODUCTION PROCESS; RELIABILITY TEST; STRESS MONITORING; STRESS SENSOR; TEMPERATURE LOADS; TEST CHIPS; THERMO-MECHANICAL STRESS; TIME-RESOLVED;

COMPUTER SIMULATION; MICROELECTRONICS; MOISTURE CONTROL; MOLDING; PACKAGING; PLASTIC MOLDS; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SENSORS; STRESS ANALYSIS; TESTING; TRANSFER MOLDING;

CHIP SCALE PACKAGES;

EID: 70449863404     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. th International Conference on Solid State Sensors, Actuators and Microsystems, Bosten, USA,2003
2. S. Majcherk, T. Lenke, L. Hirsch; A silicon test chip fort he thermomechanical analysis of MEMS packagings; Micorsyst Technol 2009, 15, pp 191-200
3. R. C. Jäger, J. C. Suhling, R. Ramani, A. T. Bradley, J. Xu; CMOS Stress sensors on (100) Silicon, IEEE J. Solid State Circuits 2000, 35 (1), pp. 85-95
4. nd European Solid-State Circuits Conference, ESSCIRC. 19.-21. Sept. 2006, pp. 424-427
5. K. M. B. Jansen, Thermomechanical modelling and characterisation of polymers, lecture notes Mechanical Engineering, TU Delft, Netherlands, 2007
6. H. Kittel; Novel stress measurement system for evaluation of package induced stress, SMART SYSTEMS INTEGRATION, Barcelona, Spain, 9.-10. April 2008