Chip-last embedded active for System-On-Package (SOP)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 292-298

  Lee, Baik Woo ^a   Sundaram, Venky ^a   Wiedenman, Boyd ^a   Yoon, Chong K ^a   Kripesh, Vaidyanathan ^b   Iyer, Mahadevan ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED SYSTEMS; MICROPROCESSOR CHIPS; RELIABILITY ANALYSIS;

EMBEDDED ACTIVE; ULTRAMINIATURIZATION;

CHIP SCALE PACKAGES;

EID: 35348823057     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373812     Document Type: Conference Paper

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