Design and calibration of a 3-D micro-strain gauge for in situ on chip stress measurements

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Volumn , Issue , 1997, Pages 252-255

  Lo, Tommy C P ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; COMPUTATIONAL METHODS; DIES; MECHANICAL VARIABLES MEASUREMENT; RESISTORS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; STRESSES;

FOUR POINT BENDING FIXTURES; SILICON PIEZORESISTIVE STRESS SENSORS;

STRAIN GAGES;

EID: 0030692924     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)