High temperature reliability of lead-free solder joints in a flip chip assembly

Journal of Materials Processing Technology

Volumn 212, Issue 2, 2012, Pages 471-483

  Amalu, Emeka H ^a   Ekere, Ndy N ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Fatigue failures; Flip chip; High temperature electronics; Intermetallic compound; Microelectronics reliability; Pb free solder; Power electronics; Solder joint

Indexed keywords

FATIGUE FAILURES; FLIP CHIP; HIGH-TEMPERATURE ELECTRONICS; INTERMETALLIC COMPOUND; MICROELECTRONICS RELIABILITY; PB FREE SOLDERS; SOLDER JOINTS;

CHIP SCALE PACKAGES; FINITE ELEMENT METHOD; INTERMETALLICS; LEAD; MICROELECTRONICS; POWER ELECTRONICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; TIN;

SOLDERING ALLOYS;

EID: 81855202026     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2011.10.011     Document Type: Article

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