Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 115-120

  Lee, S W Ricky ^a   Lau, Dennis ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; DATA ACQUISITION; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING;

BALL GRID ARRAY (BGA); CREEP STRAIN ENERGY; TEMPERATURE CYCLING TESTS; THERMAL FATIGUE;

THERMOANALYSIS;

EID: 3843091621     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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