High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology

ICAST 2009 - 2nd International Conference on Adaptive Science and Technology

Volumn , Issue , 2009, Pages 146-153

  Amalu, E H ^a   Ekere, N N ^a   Bhatti, R S ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

HTE; Materials; Miniaturization; Packaging

Indexed keywords

AIRCRAFT CRASH; AMBIENT CONDITIONS; COMPLEX INTERACTION; COMPONENT PACKAGING; ELECTRONIC CONTROL UNITS; ELECTRONIC SYSTEMS; ENVIRONMENTAL CONDITIONS; HIGH RELIABILITY; HIGH-TEMPERATURE ELECTRONICS; HTE; INTERCONNECT TECHNOLOGY; INTERCONNECTION TECHNOLOGY; LIFE EXPECTANCIES; NEW HIGH; OPERATING CONDITION; OPERATING PERIODS; OPERATING TEMPERATURE; SAFETY-CRITICAL; SYSTEM RELIABILITY;

AIRCRAFT ACCIDENTS; AIRCRAFT CONTROL; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; COMPLEXATION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE OPERATIONS; MINIATURE INSTRUMENTS; PACKAGING; PACKAGING MATERIALS; POWER ELECTRONICS; RELIABILITY; TECHNOLOGY; WELL LOGGING;

EXPERIMENTAL REACTORS;

EID: 77950934334     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICASTECH.2009.5409731     Document Type: Conference Paper

References (35)

1. J. Li, "Packaging needs for high temperature and harsh environments,", Advanced Packaging online Article, available @ ap.pennnet.com/display-article/286314/36/ARCHI/none/INDUS/1/P... - 56k - 2007-03-06
2. B. Parmentier, O. Vermesan and L. Beneteau, "Design of high temperature electronics for well logging applications," . Avilable @ google - Design of High Temperature Electronics for Well Logging Applications
3. E. H. Amalu, "PTDF PhD research proposal," unpublished. Presented to PTDF, Abuja, Nigeria, 2008
4. G. DeBruijn, et al., "High-pressure, high- temperature technologies," Slumberger Oilfield Review, Autumn, 2008
5. C. Deible, and D. Peters, "Logging ultradeep wells pushes limits," Slumberger E&P, February1,2002.Available @ www.epmag.com/archives/print/3409.htm
6. T. Bair et al., "High-pressure, high-temperature well logging, perforating and testing," Slumberger Oilfield Review, Summer, 1998
7. N.N. Ekere, and G. Nnanna, "Developing local capability for automotive manufacture in Nigeria (1)," Businessday Newspaper, Nigeria, June 01, 2009
8. L. J. Evans, "High temperature electronics for intelligent harsh environment sensors,", PWIG Workshop, NASA Glenn Research Center, May 8 2008, Available @ ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20080033116- 2008033534
9. R. Kazys, A. Voleisis and B. Voleisiene, "High temperature ultrasonic transducers: review," ISSN 1392-2114 ULTRAGARSAS (ULTRASOUND), Vol.63,No. 2, 2008
10. J. Shen and Y. C. Chan, "Research advances in nano-composite solders," microelectronics reliability available @ www.elsevier.com/locate/ microrel, 2008
11. B. Salam, A study of intermetallic compound formation and growth in Sn-Ag-Cu lead-free solder joints, PhD Thesis, University of Greenwich, United Kingdom, 2005
12. P. T. Vianco, Solder materials. AWS soldering handbook. Miami: American Welding Society: 1999 [Chapter 2]
13. J. S. Hwang, Solder paste in electronic packaging. New York : Van Nostrand. Reinhold;1989.
14. A. P. Malshe, " Challenges in the packaging of MEMS," The International Journal of Microcircuits and Electronic Packaging, Volume 22, Number 3, Third Quarter 1999 (ISSN 1063-1674)
15. D. H. Whalley, "Liquid solder interconnects for high temperature applications," available http://gow.espsrc.ac.uk/viewGrant.aspx?GrantRef= GR/S87485/01
16. J. Li, S. H. Mannan, M. P. Clode,D. N. Fenner,D. C. Whalley, K. Chen, "Reliability and failure analysis of dummy IGBT assembles using liquid solder joint under thermal cycling," HITEC 2006, Santa Fe, USA, pp. 390 - 397, May 2006
17. S. H. Mannan, and M. P. Clode, "Material and processes for implementing high temperature liquid interconnects," IEEE Trans.on Adv.packaging,Vol.27, No.3,pp.508-514,2004
18. S. H. Mannan, M. P. Clode, and M. Dagher, "Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder," J Electron Mater, Vol.34.No.2, pp.125-131, 2005
19. th Electronics Packaging Technology Conference, 2007
20. W. D. Brown, Editor, "Advanced electronic packaging: with emphasis on multichip modules," IEEE Press, New York, pp. 3-8, 16-22,-35-41, 1999
21. R. Ramesham. And R. Ghaffarian, "Challenges in interconnection And packaging of microelectromechanical systems (MEMS)," Electronic Components and Technology Conference, 2000, USA. 2000 proceedings, 50th
22. D. J. Monk, and M. K. Shah, "Packaging and testing considerations of bulk micromachined, piezoresistive pressure sensors," Motorola Sensor Products Division, Commercialization of Microsystems '96,pp. 136-149,1996
23. G. H. Kroetz, M. H. Eickhoff, and H. Moeller, "Silicon compatible materials for harsh environment sensors," Sensors and Actuator 74 (1999) 182-189
24. R. Ziermann, J. V. Berg, E. Obermeier, M. Eickhoff, and G. Kroetz, "A high temperature pressure sensor with b-SiC piezoresistors on SOI substrates," Technol. Digest, 9th Int. Conf. on Solid-State Sensors and Actuators, Chicago, USA (1997) 1141.
25. R. S. Okojie, A. A. Ned, and A. D. Kurtz, "Operation of α(6H).-SiC pressure sensor at 500°C," Technol. Digest, 9th Int. Conf. on Solid-State Sensors and Actuators, Chicago, USA (1997) 1407
26. S. D. Senturia, "Microsensors vs. integrated circuits: a study in contrasts," IEEE, Electron Devices Meeting, 3-6 Dec 1989, Pages 3-7
27. R. C. Kullberg, et al., "Processes and materials for creating and maintaining reliable vacuum and controlled atmospheres in hermetically sealed MEMs packages," SPIE proceedings series, vol.3880, pp. 75-82, 1999
28. J. Mallon, et al., "Low-cost,high-volume packaging techniques for silicon sensors and actuators," IEEE, Solid-State Sensors and Actuators Workshop, Technical Digest, 6-9 June, 1988
29. B. Salam, et al., "A Study of Inter-Metallic Compounds (IMC) Formation and Growth in Ultra-Fine Pitch Sn-Ag-Cu Lead-Free Solder joints," IEEE, Electronics System integration Technology Conference, Dresden, Germany, 2006
30. B. Salam. et al., "Study of the interfacial microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation," IEEE, Electronic component and technology Conference, 2001
31. M. N. Islam, A. Sharif, and Y. C. Chan, "Effect of volume in interfacial reaction between eutectic Sn-3.5%Ag-0.5%Cu solder and Cu metallization in microelectronic packaging," Journal of Electronic Materials, Vol.34, No.2,2005
32. J. Li, et al., "Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In Sn/Nb System", IEEE, Electronics Packaging Technology Conference, Dec., 2007, pp. 43-46
33. J. M. Li., "Packaging design & manufacture of high temperature electronics module for 225°C application utilizing hybrid microelectronics technology," , Available @ google www.vectron.com/products/appnotes/ HiTEC2004
34. I. Y. Chien, and M. N. Nguyen, "Low stress polymer die attach adhesive for plastic packages", Electronic Engineering pp.41-46, February 1995
35. Vectron International High Temperature Electronics - Technology and Capabilities Available @ www.vectron.com/products/hitemp/hitemp-package- selection.htm