Solder joint shape and standoff height prediction and integration with FEA-based methodology for reliability evaluation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1739-1744

  Sidharth, ^a   Blish, Richard ^a   Natekar, Devendra ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC LOADS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; RELIABILITY THEORY; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION;

ELECTRONIC ASSEMBLY;

CHIP SCALE PACKAGES;

EID: 0036290954     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008345     Document Type: Article

References (8)

1. Prediction of solder joint geometry
2. An overview of solder bump shape prediction algorithms with validation
3. Solder joint formation simulation and finite element analysis
4. Solder joint design for optimal manufacturing process and field reliability
5. Finite element method for predicting equilibrium shapes of solder joints