Investigation of bump crack and deformation on Pb-free flip chip packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1536-1540

  Libres, Jeremias ^a   Arroyo, J Carlos ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; EFFECTIVE SOLUTION; FAILURE MECHANISM; FLIP CHIP BGA; FLIP-CHIP PACKAGES; FLIP-CHIP PRODUCT; FLUX RESIDUES; PACKAGE DEVELOPMENT; PACKAGE INTERCONNECTS; PACKAGE RELIABILITY; PB-FREE; ROOT CAUSE; SEVERE DEFORMATION; SUBSTRATE INTERFACE; TEMPERATURE CYCLING; UNDERFILL INTERFACES; UNDERFILL MATERIALS; UNDERFILL PROPERTIES; UNDERFILLS;

DEFORMATION; FLIP CHIP DEVICES; LEAD; PACKAGING;

CRACKS;

EID: 77955199010     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490791     Document Type: Conference Paper

References (9)

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3. Bernd Ebersberger, et al, "Qualification of SnAg Solder Bumps for Lead-Free Flip Chip Applications", ECTC 2004 (683-691).
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6. Charles Zhang, et al, "Thermal Fatigue Properties of Lead- Free Solders on Cu and NiP Under Bump Metallurgies", ECTC 2001
7. Jeremias Libres, et al, "Challenges in the Assembly of Large Die, High Bump Density Pb-free Flip Chip Packages", Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
8. F. Zhang, et al, "An Investigation Into the Effects of Flux Residues on Properties of Underfill Materials for Flip Chip Packages", IEE Transactions on Components and Packaging Technologies, Vol.26, No.1, December 2003 (233-238)
9. K. N. Tu, "Solder Joint Technology: Materials, Properties, and Reliability", Springer, New York (2007)