Reliability of Sn-3.5Ag solder joints in high temperature packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1823-1829

  Muralidharan, Govindarajan ^a   Kurumaddali, Kanth ^a   Kercher, Andrew K ^a   Leslie, Scott G ^b  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b POWEREX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DAMAGE ACCUMULATION; DAMAGE EVOLUTION; DIRECT BONDED COPPERS; ELECTRIC GRIDS; FINITE-ELEMENT PREDICTIONS; HIGH RESOLUTION; HIGH TEMPERATURE; HIGH-TEMPERATURE PACKAGING; NON-LINEAR FINITE ELEMENT MODEL; OPERATING TEMPERATURE; PLASTIC WORK; SILICON DIE; SN-3.5AG; SOLDER JOINTS; STRESS STATE; THERMAL CYCLING RELIABILITY; WIDE BAND GAP;

FINITE ELEMENT METHOD; HIGH TEMPERATURE APPLICATIONS; MECHANICAL PROPERTIES; MESH GENERATION; RADIOLOGY; SILVER; SOLDERING ALLOYS; STRESSES; THERMAL CYCLING;

TIN;

EID: 77955200766     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490717     Document Type: Conference Paper

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