Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 516-521

  Lau, Dennis ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; FINITE ELEMENT METHOD; THERMAL CYCLING;

PBGA FATIGUE LIFE; ROOM TEMPERATURE; THERMAL CYCLING MACHINES; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 28444465556     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Lee, S. W. R., Lui, B. H. W., Kong, Y. H., Baylon, B., Leung, T., Umali, P. and Agtarap, H., "Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders," Soldering & Surface Mount Technology, Vol. 14, No. 3, 2002, pp. 46-50.
2. th EuroSimE Conference, Brussels, Belgium, May 10-12, 2004, pp. 115-120.
3. Lau, J. H. and Pao, Y.-H., Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, 1997.
4. st IEEE International Reliability Physics Symposium, 30 March-4 April 2003, pp. 447-451.
5. Pang, J. H. L. and Chong, D. Y. R., "Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models," IEEE Transactions on Advanced Packaging, Vol. 24, No. 4, 2001, pp. 499-506.
6. Syed, A. R., "Factors affecting creep-fatigue interaction in eutectic Sn/Pb solder joints," Advances in Electronic Packaging, Vol. 2, ASME, New York, NY, 1997, pp. 1535-1542.