Pb-Free solder joint reliability of fine pitch chip-scale packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1587-1590

  Xie, Weidong ^a   Lee, Tae Kyu ^a   Liu, Kuo Chuan ^a   Xue, Jie ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY CONDITION; BALL GRID ARRAY PACKAGES; BOARD-LEVEL RELIABILITY; BULK SOLDER; DIE SIZE; FINE PITCH; FINE PITCH COMPONENT; GRAIN ORIENTATION; GRAIN SIZE; HIGH DENSITY; HIGH RELIABILITY; ISOTHERMAL AGING; JOINT BEHAVIOR; JOINT RELIABILITY; PB FREE SOLDERS; PB-FREE; SIGNIFICANT IMPACTS; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINT RELIABILITY; SOLDER VOLUME; STENCIL THICKNESS; STRESS LEVELS; TEST VEHICLE; WIDE SPECTRUM;

DIES; ELECTRONIC EQUIPMENT MANUFACTURE; LEAD; PACKAGING; RELIABILITY; RESISTORS; SOLDERING; SOLDERING ALLOYS;

CHIP SCALE PACKAGES;

EID: 77955187463     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490777     Document Type: Conference Paper

References (5)

1. Clech, Jean-Paul, "Lead-Free and Mixed Assembly Solder Joint Reliability Trends," APEX 2004, Anaheim, California, February, 2004.
2. Lee, Tae-Kyu, etc, "Impact of Isothermal Aging on Long Term Reliability of Fine Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects," 2010 TMS Annual Meeting & Exhibition, Seattle, Washington, February 2010.
3. Kim, Dong Hyun, "Board Level Reliability Study of Lead-free Packages," Cisco internal report, 2008.
4. th ECTC, 2009.
5. th ECTC, 2006, p875-883.