Interaction effect of voids and standoff height on thermomechanical durability of BGA solder joints

IEEE Transactions on Device and Materials Reliability

Volumn 9, Issue 3, 2009, Pages 348-355

  Ladani, Leila J ^a   Razmi, Jafar ^a  

^a Utah State University   (United States)

Author keywords

Cyclic loading; Solder joints; Thermomechanical durability; Voids

Indexed keywords

AREA EFFECT; AREA FRACTION; BGA SOLDER JOINTS; CYCLIC LOADING; DETRIMENTAL EFFECTS; DIFFERENT SIZES; FINITE ELEMENT ANALYSIS; GLOBAL-LOCAL; IN-PHASE; INTERACTION EFFECT; INTERACTIVE EFFECT; LOAD BEARING; MODELING APPROACH; NONMONOTONIC; NONMONOTONIC BEHAVIORS; PAPER DOCUMENTS; SIMULATION STUDIES; SOLDER BALLS; SOLDER JOINTS; STAND OFF HEIGHT; STRESS CONCENTRATION FACTORS; SURFACE ENERGIES; SURFACE EVOLVER SOFTWARE; THERMOMECHANICAL DURABILITY; VISCOPLASTIC; VOID SIZE; VOID VOLUME; VOIDS;

BEARING PADS; BEARINGS (STRUCTURAL); COMPOSITE MICROMECHANICS; CYCLIC LOADS; DURABILITY; FATIGUE OF MATERIALS; PHASE INTERFACES; SOLDERED JOINTS; STRESS CONCENTRATION; SURFACE CHEMISTRY; SURFACE TENSION; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL; VOID FRACTION;

SOLDERING;

EID: 70249097778     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2009.2020600     Document Type: Article

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