Prediction of solder joint geometries in array-type interconnects

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 114-121

  Heinrich, S M ^a   Schaefer, M ^b   Schroeder, S A ^c   Lee, P S ^d  

^a Department of Civil and Environmental ^*  (United States)

^b Marquette University   (United States)

^c Rockwell International   (United States)

^d Allen Bradley Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GEOMETRY; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; OPTIMIZATION; RELIABILITY; SURFACE TENSION; SURFACES; THERMAL CYCLING;

ARRAY TYPE INTERCONNECTS; CONTACT PADS; MOLTEN JOINT FORCE; SOLDER INJECTION TECHNOLOGY; SOLDERED JOINT GEOMETRIES;

SOLDERED JOINTS;

EID: 0030230333     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792140     Document Type: Article

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