Effect of glue on reliability of flip chip BGA packages under thermal cycling

Microelectronics Reliability

Volumn 50, Issue 7, 2010, Pages 1000-1006

  Nguyen, Tung T ^a   Lee, Donggun ^a   Kwak, Jae B ^a   Park, Seungbae ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVERSE EFFECT; DIGITAL IMAGE CORRELATIONS; EXPERIMENTAL AND NUMERICAL METHODS; FEM MODELS; FINITE ELEMENT ANALYSIS; FLIP CHIP BGA; MATERIAL PROPERTY; MECHANICAL IMPACTS; MECHANICAL SHOCK; NUMERICAL PARAMETRIC STUDIES; POSITIVE EFFECTS; THERMAL-MECHANICAL BEHAVIOR;

FINITE ELEMENT METHOD; GLUES; IMAGE ANALYSIS; MECHANICAL PROPERTIES; NUMERICAL METHODS; RELIABILITY; THERMAL CYCLING; VIBRATIONS (MECHANICAL);

GLUING;

EID: 77955714459     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.04.003     Document Type: Conference Paper

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