Impact of ball via configurations on solder joint reliability in tape-based, chip-scale packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1475-1483

  Zahn, Bret A ^a  

^a ChipPAC Incorporated   (United States)

Author keywords

Ball grid array package; Chip scale package; Finite element modeling; Solder fatigue

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; COMPUTER SOFTWARE; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; THERMAL CYCLING;

BALL GRID ARRAY PACKAGES; SOLDER FATIGUE;

SOLDERED JOINTS;

EID: 0036297303     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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16. Comprehensive solder fatigue and thermal characterization of a silicon based multi-chip module package utilizing finite element analysis methodologies
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