Impact of usage conditions on solder joint fatigue life

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 14-19

  Zhang, Zhen ^a   Park, S B ^b   Darbha, Krishna ^a   Master, Raj N ^a  

^a MICROSOFT   (United States)

^b State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; FATIGUE CRACKING; FATIGUE LIFE; FLIP CHIP; GLASS TRANSITION TEMPERATURE; IN-FIELD; JUNCTION TEMPERATURES; LOAD SHARING; MICROELECTRONIC PACKAGE; OPERATION TEMPERATURE; ORGANIC PACKAGES; PACKAGE SUBSTRATES; POWER CYCLING; QUALIFICATION TEST; RAMP RATES; SET-POINT; SILICON DIE; SOLDER BUMP; SOLDER JOINT FATIGUE; SOLDER JOINTS; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS; THERMAL CYCLE; UNDERFILLS; VISCOPLASTIC; VISCOPLASTIC DEFORMATION;

DEFORMATION; FATIGUE DAMAGE; GLASS TRANSITION; MICROELECTRONICS;

THERMAL EXPANSION;

EID: 77955195995     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490874     Document Type: Conference Paper

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