Thermomechanical reliability study of flip-chip solder bumps: Using laser ultrasound technique and finite element method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 611-622

  Yang, Jin ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER BUMPING;

ABS RESINS; ACOUSTIC WAVES; ARSENIC COMPOUNDS; AUTOMOBILE PARTS AND EQUIPMENT; BRAZING; COMPUTER NETWORKS; CONSTITUTIVE MODELS; CORRELATION METHODS; CRACKS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FORMING; GEODETIC SATELLITES; INSPECTION; INSPECTION EQUIPMENT; INTERFEROMETERS; INTERFEROMETRY; LASERS; NEODYMIUM LASERS; PARAMETER ESTIMATION; PULSED LASER APPLICATIONS; RELIABILITY; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; ULTRASONIC EQUIPMENT; ULTRASONIC TRANSMISSION; ULTRASONICS; WELDING;

SOLDERING;

EID: 51349113088     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550036     Document Type: Conference Paper

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