Optimization of submicron deep trench profiles with the STiGer cryoetching process: Reduction of defects

Journal of Micromechanics and Microengineering

Volumn 21, Issue 8, 2011, Pages

  Tillocher, T ^a   Kafrouni, W ^a   Ladroue, J ^a,b   Lefaucheux, P ^a   Boufnichel, M ^b   Ranson, P ^a   Dussart, R ^a  

^a UNIVERSITÉ D'ORLÉANS   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL DIMENSION; CRYOGENIC ETCHING; DEEP TRENCH; ETCH RATES; HIGH ASPECT RATIO STRUCTURES; LOW OXYGEN; PASSIVATION CYCLES; PASSIVATION LAYER; SUBMICRON; TIME MULTIPLEXED;

ASPECT RATIO; DEFECTS; ETCHING; SULFUR HEXAFLUORIDE;

PASSIVATION;

EID: 80051535902     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/8/085005     Document Type: Article

References (35)

1. Brunet M, Scheid E, Galicka-Fau, Andrieux M, Legros C, Gallet I, Herbst M and Schamm S 2009 Microelectron. Eng. 86 2034
2. Kamto A, Divan R, Sumant A V and Burkett S L 2010 J. Vac. Sci. Technol. A 28 719
3. Abhulimen I U, Polamreddy S, Burkett S, Cai L and Schaper L 2007 J. Vac. Sci. Technol. B 25 1762
4. Richter K, Viehweger K, He J and Bartha J-W 2009 Plasma Process. Polym. 6 S193
5. Lärmer F and Schilp A 1994 German Patent No DE-4241045 C1
6. Lärmer F and Schilp A 1996 US Patent No 5 501 893
7. Blauw M A, Zijlstra T and van der Drift E 2001 J. Vac. Sci. Technol. B 19 2930
8. Rangelow I W 2001 Vacuum 62 279
9. Walker M J 2001 Proc. SPIE 4407 89
10. Craigie C J D, Sheehan T, Johnson V N, Burkett S L, Moll A J and Knowlton W B 2002 J. Vac. Sci. Technol. B 20 2229
11. Jansen H V, de Boer M J, Unnikrishnan S, Louwerse M C and Elwenspoek M C 2009 J. Micromech. Microeng. 19 033001
12. Blauw M A, Gracium G, Sloof W G, French P J and van der Drift E 2002 J. Vac Sci. Technol. B 20 3106
13. Ohara J, Takeuchi Y and Sato K 2009 J. Micromech. Microeng. 19 095022
14. Kawata H, Yasuda M and Hirai Y 2006 Japan. J. Appl. Phys. 45 2297
15. Abdolvand R and Ayasi F 2008 Sensors Actuators A 144 109
16. Tachi S, Tsujimoto K and Okudaira S 1988 Appl. Phys. Lett. 52 616
17. Bartha J W, Greshner J, Puech M and Maquin P 1995 Microelectron. Eng. 27 453
18. de Boer M J, Gardeniers J G E, Jansen H V, Smulders E, Gilde M-J, Roelofs G, Sasserath J N and Elwenspoek M 2002 J. Microelectromech. Syst. 11 385
19. Dussart R, Boufnichel M, Marcos G, Lefaucheux P, Basillais A, Benoit R, Tillocher T, Mellhaoui X, Estrade-Szwarckopf H and Ranson P 2004 J. Micromech. Microeng. 14 190
20. Mellhaoui X, Dussart R, Tillocher T, Lefaucheux P, Ranson P, Boufnichel M and Overzet L J 2005 J. Appl. Phys. 98 104901
21. Isakovic A F and Evans-Lutterodt K 2008 J. Vac. Sci. Technol. A 26 1182
22. Jansen H V, de Boer M J, Ma K, Gironès M, Unnikrishnan S, Louwerse M C and Elwenspoek M C 2010 J. Micromech. Microeng. 20 075027
23. Tillocher T, Dussart R, Overzet L J, Mellhaoui X, Lefaucheux P, Boufnichel M and Ranson R 2008 J. Electrochem. Soc. D 155 187
24. Dussart R, Lefaucheux P, Mellhaoui X, Overzet L J, Ranson P, Tillocher T and Boufnichel M 2008 French Patent No FR 2914782
25. Jiang H, Dussart R, Pichon L E, Duluard C Y, Oubensaid E H, Pereira J, Lefaucheux P, Boufnichel P and Ranson P 2008 JNTE08, French Symp. on Emerging Technologies for Micronanofabrication jnte08.trans-gdr.lpn.cnrs.fr/FILES/p28.pdf
26. Duluard C Y, Dussart R, Tillocher T, Pichon L E, Lefaucheux P, Puech M and Ranson P 2008 Plasma Sources Sci. Technol. 17 045008
27. Boufnichel M, Aachboun S, Grangeon F, Lefaucheux P and Ranson P 2002 J. Vac. Sci. Technol. B 20 1508
28. Dussart R, Mellhaoui X, Tillocher T, Lefaucheux P, Volatier M, Socquet-Clerc C, Brault P and Ranson P 2005 J. Phys. D: Appl. Phys. 38 3395
29. Boufnichel M, Aachboun S, Lefaucheux P and Ranson P 2003 J. Vac. Sci. Technol. B 21 267
30. Lieberman M A and Lichtenberg A J 2005 Principles of Plasmas Discharges and Materials Processing 2nd edn (New York: Wiley-Interscience)
31. Abdollahi-Alibeik S, McVitties J P, Saraswat K C, Sukharev V and Schoenborn P 1999 J. Vac. Sci. Technol. A 17 2485
32. Kiihamäki J and Franssila S 1999 J. Vac. Sci. Technol. A 17 2280
33. Coburn J W and Winters H F 1989 Appl. Phys. Lett. 55 2730
34. Gracium G, Blauw M A, van der Drift E, Sarro P M and French P J 2002 J. Micromech. Microeng. 12 390
35. Boufnichel M, Lefaucheux P, Aachboun S, Dussart R and Ranson R 2005 Microelectron. Eng. 77 327