SCOPUS 정보 검색 플랫폼

Volumn 45, Issue 6 B, 2006, Pages 5597-5601

Si etching with high aspect ratio and smooth side profile for mold fabrication

Author keywords

Imprint mold; SF6+O2 plasma; Silicon deep etching; Smooth side wall; Thermal imprint

Indexed keywords

ASPECT RATIO; FABRICATION; PLASMA DEVICES; POLYMETHYL METHACRYLATES; SILICON; THERMOANALYSIS;

IMPRINT MOLD; MOLD FABRICATION; SILICON DEEP ETCHING; SMOOTH SIDE WALL; THERMAL IMPRINT;

ETCHING;

EID: 33745679176 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.45.5597 Document Type: Review

Times cited : (13)

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