Cyclic, cryogenic, highly anisotropic plasma etching of silicon using SF6/O2

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 26, Issue 5, 2008, Pages 1182-1187

  Isakovic, A F ^a   Evans Lutterodt, K ^a   Elliott, D ^a   Stein, A ^a   Warren, J B ^a  

^a BROOKHAVEN NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOSCH PROCESSES; DEEP REACTIVE ION ETCHING; ETCHING METHOD; HYBRID PROCESSING; PROCESS STEPS;

CRYOGENICS; ETCHING; PASSIVATION; PLASMA ETCHING; PLASMAS; SILICON;

REACTIVE ION ETCHING;

EID: 50849119391     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2960557     Document Type: Article

References (10)

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