Enhanced surface hardness of flexible polycarbonate substrates using plasma-polymerized organosilicon oxynitride films by air plasma jet under atmospheric pressure

Surface and Coatings Technology

Volumn 205, Issue 13-14, 2011, Pages 3856-3864

  Lin, Yung Sen ^a   Weng, Mao Syuan ^a   Chung, Tsair Wang ^b   Huang, Charming ^c  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^c KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

Atmospheric pressure plasma; Hardness; PECVD; Plasma polymerization; XPS

Indexed keywords

AIR PLASMAS; ATMOSPHERIC PRESSURE PLASMA JETS; ATMOSPHERIC PRESSURE PLASMAS; ATOMIC COMPOSITIONS; ENHANCED SURFACE; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FOURIER TRANSFORMED INFRARED SPECTROSCOPY; FTIR; HARD SURFACE; HIGH-RATE DEPOSITION; ORGANOSILICONES; OXYNITRIDE FILMS; OXYNITRIDES; PECVD; PENCIL HARDNESS; POLYCARBONATE SUBSTRATES; ROOM TEMPERATURE; SOFT SURFACE; SURFACE CHARACTERISTICS; SURFACE HARDNESS; VARIOUS SUBSTRATES; XPS;

ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; ATMOSPHERICS; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (CHEMICAL); FIELD EMISSION; FIELD EMISSION MICROSCOPES; HARDNESS; INFRARED SPECTROSCOPY; NITRIDES; PLASMA ACCELERATORS; PLASMA DEPOSITION; PLASMA JETS; PLASMA POLYMERIZATION; PLASMA SOURCES; POLYMERS; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; SURFACE MORPHOLOGY; X RAY PHOTOELECTRON SPECTROSCOPY;

SUBSTRATES;

EID: 79952490418     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.01.060     Document Type: Article

References (35)

1. Zajickova L., Burikova V., Perina V., Mackova A., Subedi D., Janca J., Smirnov S. Surf. Coating Technol. 2001, 142-144:449.
2. Rats D., Martinu L., von Stebut J. Surf. Coating Technol. 2000, 123:36.
3. Lugscheider E., Bobzin K., Maes M., Kramer A. Thin Solid Films 2004, 459:313. (2004).
4. Mailhot B., Rivaton A., Gardette J.L., Moustaghfir A., Tomasella E., Jacquet M., Ma X.G., Komvopoulos K. J. Appl. Phys. 2006, 99:104310.
5. Wu L.Y.L., Chwa E., Chen Z., Zeng X.T. Thin Solid Films 2008, 516:1056.
6. Martinu L., Poitras D. J. Vacuum Sci. Technol. A 2000, 18:2619.
7. Trunec L., Zajickova V., Burikova F., Studnicka P., Stahel V., Prysiazhnyi V., Perina J., Houdkov Z., Navartil D., Franta J. Physics. D 2010, 43:225403.
8. Ding Y., Pan Q., Jin J., Jia H., Shirai H. Thin Solid Films 2010, 518:3487.
9. Huang C., Liu C.-H., Wu S.-Y. Surf. Interface Anal. 2009, 41:44.
10. Ramamoorthy A., Rahman M., Mooney D.A., Don MacElroy J.M., Dowling D.P. Surf. Coating Technol. 2008, 202:4130.
11. Han M.H., Noh J.H., Lee T.I., Choi J.H., Park K.W., Hwang H.S., Song K.M., Baik H.K. Plasma Process Polym. 2008, 5:861.
12. Babayan S.E., Jeong J.Y., Schutze A., Tu J., Moravej V.M., Selwyn G.S., Hicks R.F. Plasma Sources Sci. Technol. 2001, 10:573.
13. Babayan S.E., Jeong J.Y., Tu V.J., Park J., Selwyn G.S., Hicks R.F. Plasma Sources Sci. Technol. 1998, 7:286.
14. Sawada Y., Ogawa S., Kogoma M. J. Phys. D 1995, 28:1661.
15. Kim Y.S., Lee J.H., Lim J.T., Park J.B., Yeom G.Y. Thin Solid Films 2009, 517:4065.
16. Raballand V., Benedikt J., Hoffmann S., Zimmermann M., Von Keudell A. J. Appl. Phys. 2009, 105:083304.
17. Massines F., Gherardi N., Fornelli A., Martin S. Surf. Coating Technol. 2005, 200:1855.
18. Alexandrov S.E., McSporran N., Hitchman M.L. Chem. Vapor Depos. 2005, 11:481.
19. Van Hest M.F.A.M., Mitu B., Schram D.C., Van de Sanden M.C.M. Thin Solid Films 2004, 449:52.
20. Van Hest M.F.A.M., Klaver A., Schram D.C., Van de Sanden M.C.M. Thin Solid Films 2004, 449:40.
21. Rymuza Z., Misiak M., Rzanek-Boroch Z., Schmidt-Szalowski K., Janowska J. Thin Solid Films 2004, 466:158.
22. Schmidt-Szalowski K., Rzanek-Boroch Z., Sentek J., Rymuza Z., Kusznierewicz Z., Misiak M. Plasmas Polym. 2000, 5:173.
23. Huang C., Liu C.-H., Su C.-H., Hsu W.-T., Wu S.-Y. Thin Solid Films 2009, 517:5141.
24. Schafer J., Foest R., Quade A., Ohl A., Weltmann K.D. J. Phys. D 2008, 41:194010.
25. Morent R., De Geyter N., Van Vlierberghe S., Dubruel P., Leys C., Schacht E. Surf. Coating Technol. 2009, 203:1366.
26. Morent R., De Geyter N., Van Vlierberghe S., Dubruel P., Leys C., Gengembre L., Schacht E., Payen E. Prog. Org. Coat. 2009, 64:304.
27. Starostine S., Aldea E., de Vries H., Creatore M., van de Sanden M.C.M. Plasma Process Polym. 2007, 4:S440.
28. T. Hanada, T. Negishi, I. Shiroishi, T. Shiro, Thin Solid Films 518 3089.
29. Sivaramakrishnan K., Alford T.L. Appl. Phys. Lett. 2010, 96:201109.
30. Kang M.-G., Joon Park H., Hyun Ahn S., Jay Guo L. Sol. Energ. Mat. Sol. C. 2010, 94:1179.
31. Morent R., De Geyter N., Axisa F., De Smet N., Gengembre L., De Leersnyder E., Leys C., Vanfleteren J., Rymarczyk-Machal M., Schacht E., Payen E. J. Phys. D 2007, 40:7392.
32. Leu G.F., Brockhaus A., Engemann J. Surf. Coating Technol. 2003, 174-175:928.
33. Bhattacharyya A.S., Mishra S.K., Mukherjee S. J. Vacuum Sci. Technol. A 2010, 28:505.
34. Luna-López J.A., García-Salgado G., Díaz-Becerril T., Carrillo López J., Vázquez-Valerdi D.E., Juárez-Santiesteban H., Rosendo-Andrés E., Coyopol A. Mater. Sci. Eng. B 2010, 174:88.
35. Lin Y.S., Liao Y.H., Hu C.H. J. NonCryst. Solids 2009, 355:182.