SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 392, Issue 1-2, 2005, Pages 237-246

Electric current effect on microstructure of ball grid array solder joint

(2) Wu, B Y a Chan, Y C a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

BGA solder joint; Diffusion; Dissolution; Electromigration; Joule heating

Indexed keywords

CATHODES; CURRENT DENSITY; DIFFUSION; DISSOLUTION; ELECTROMIGRATION; HEATING; INTERMETALLICS; MELTING; METALLIZING; MICROSTRUCTURE; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

BALL GRID ARRAY (BGA) SOLDER JOINTS; HEAT GENERATION; JOULE HEATING; MELTING POINTS;

ELECTRIC CURRENTS;

EID: 15544384200 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2004.09.044 Document Type: Article

Times cited : (22)

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