Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders

Journal of Alloys and Compounds

Volumn 475, Issue 1-2, 2009, Pages 238-244

  Chen, Chih ming ^a   Hung, Yu min ^a   Lin, Ching hsuan ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Bi; Cu; Electromigration; Microstructure; Sn 9 wt. Zn

Indexed keywords

BRAZING; COOLING; ELECTROMIGRATION; FURNACES; MICROSTRUCTURE; SOLDERING ALLOYS; WELDING; ZINC;

A DENSITIES; ANODE SIDES; BI; COOLING CONDITIONS; CU; CU ELECTRODES; CURRENT-STRESSING; ELECTROMIGRATION BEHAVIORS; ELECTRON FLOWS; FURNACE COOLING; HIGHER TEMPERATURES; MICRO-STRUCTURAL CHANGES; SN-8ZN-3BI; SN-9 WT.% ZN;

TIN;

EID: 63649127166     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.07.106     Document Type: Article

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