Creep behaviour of composite lead-free electronic solder joints

Soldering and Surface Mount Technology

Volumn 15, Issue 1, 2003, Pages 39-42

  Guo, F ^a   Lee, J ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Composite solders; Lead free soldering

Indexed keywords

BONDING; CREEP; MIXING; REINFORCEMENT; RELIABILITY; SERVICE LIFE; STRAIN;

COMPOSITE LEAD FREE ELECTRONIC SOLDER JOINTS; STEADY STATE CREEP RATE;

SOLDERED JOINTS;

EID: 0037215783     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310455716     Document Type: Article

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