Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1363-1367

  Yang, Q L ^a   Shang, J K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Electromigration; Interconnect; Interface; Solder

Indexed keywords

CATHODES; COPPER; CURRENT DENSITY; ELECTROMIGRATION; SEGREGATION (METALLOGRAPHY); SOLDERING ALLOYS; STRESS ANALYSIS; SURFACE CHEMISTRY; TIN;

ELECTRON FLOW; INTERCONNECT; INTERFACE;

BISMUTH;

EID: 28044438993     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0191-5     Document Type: Conference Paper

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