Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

Journal of Alloys and Compounds

Volumn 487, Issue 1-2, 2009, Pages 458-465

  Lin, Hsiu Jen ^a,b   Lin, Jian Shian ^b,c   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

Ag Cu pad; Au Ni(P) Cu pad; Electromigration; Sn 3Ag 0.5Cu; Sn 3Ag 0.5Cu 0.5Ce 0.2Zn

Indexed keywords

AG/CU PAD; AU/NI(P)/CU PAD; AVERAGE CURRENT DENSITIES; CURRENT-STRESSING; DIFFUSION DRIVEN; ELECTROMIGRATION BEHAVIOR; ELECTROMIGRATION DAMAGE; ELECTRON FLOW; ROOM TEMPERATURE; SN-3AG-0.5CU; SN-3AG-0.5CU-0.5CE-0.2ZN; SNAGCU SOLDER; SOLDER JOINTS; SOLDER MATRIX; WHISKER GROWTH;

ALLOYS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; ELECTROMIGRATION; GOLD ALLOYS; MECHANICAL PROPERTIES; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; ZINC;

TIN;

EID: 70350618591     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.07.167     Document Type: Article

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