SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 37, Issue 11, 2008, Pages 1721-1726

Electromigration in line-type Cu/Sn-Bi/Cu solder joints

(2) Gu, X a Chan, Y C a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

Electromigration; Line type Cu Sn Bi Cu solder joints; Microstructure

Indexed keywords

ACTUAL TEMPERATURE; ANODE SIDE; IN-LINE; INTERMETALLIC COMPOUND; LINE-TYPE CU/SN-BI/CU SOLDER JOINTS; LINEAR DEPENDENCES; MICROSTRUCTURE; MOLTEN STATES; SOLDER JOINTS; SOLID STATES;

BISMUTH COMPOUNDS; BRAZING; CLARIFICATION; COPPER; ELECTROMIGRATION; EUTECTICS; INTERMETALLICS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; WELDING;

TIN;

EID: 53149139835 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0539-8 Document Type: Article

Times cited : (57)

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