Effect of underfill on electromigration lifetime in flip chip joints

Journal of Alloys and Compounds

Volumn 481, Issue 1-2, 2009, Pages 659-663

  Yamanaka, Kimihiro ^a   Ooyoshi, Takafumi ^a   Nejime, Takayuki ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

Back stress; Electromigration; Flip chip; In; Sn Ag Cu

Indexed keywords

BACK STRESS; FLIP CHIP; FLIP CHIP JOINTS; HIGH CURRENT DENSITIES; IN; INTERNAL STRESS; SN-AG-CU; SOLDER JOINTS; UNDERFILL; YOUNG'S MODULUS;

BRAZING; DEFORMATION; ELECTROMIGRATION; FLIP CHIP DEVICES; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; WELDING;

TIN;

EID: 67649265382     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.03.063     Document Type: Article

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