SCOPUS 정보 검색 플랫폼

Volumn 38, Issue 1, 2009, Pages 78-87

Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

(5) Kumar, Aditya a,b Yang, Ying a Wong, Chee C a Kripesh, Vaidhyanathan b Chen, Zhong a

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b INSTITUTE OF MICROELECTRONICS (Singapore)

Author keywords

Electromigration; Interfacial reactions; Intermetallic compound (IMC); Lead free solder; Metallization; Tensile strength

Indexed keywords

ANODE SIDES; BRITTLE FAILURES; BULK SOLDERS; CRITICAL CURRENT DENSITIES; ELECTRIC CURRENT DENSITIES; ELECTROLESS; FRACTOGRAPHIC ANALYSIS; INTERFACE REGIONS; INTERFACIAL MICROSTRUCTURES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND (IMC); LEAD-FREE SOLDER; MECHANICAL PERFORMANCES; METALLIZATION; METALLIZATIONS; MICROTENSILE TESTS; SOLDER JOINTS; TWO TYPES;

BRAZING; BRITTLENESS; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); DENSITY (SPECIFIC GRAVITY); DUCTILE FRACTURE; ELECTRIC CURRENT MEASUREMENT; ELECTRIC CURRENTS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTROMIGRATION; FRACTURE; GROWTH (MATERIALS); INTERMETALLICS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; METALLIZING; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; TENSILE STRENGTH; THERMAL AGING; TIN; WELDING;

BRITTLE FRACTURE;

EID: 57649217806 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0565-6 Document Type: Conference Paper

Times cited : (33)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.