SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2756-2761

Resistance changes in eutectic Sn-Bi solder joints during electromigration

(7) Guo, Fu a Xu, Guangchen a,b Sun, Jia a Xia, Zhidong a Lei, Yongping a Shi, Yaowu a Li, Xiaoyan a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

b Michigan State University (United States)

Author keywords

Electromigration; Eutectic Sn Bi; Resistance

Indexed keywords

AMBIENT TEMPERATURES; ATOMIC MOVEMENTS; BINARY EUTECTICS; COMPLEX INTERACTION; CONTROLLED SYSTEM; ELECTROMIGRATION DAMAGE; ELECTRON FLOW; ELECTRONIC INTERCONNECTS; ELECTRONIC PRODUCT; ELECTRONIC SOLDERS; HIGH CURRENT DENSITIES; LABVIEW; RESISTANCE CHANGE; RESISTANCE VALUES; SIGNIFICANT DETERIORATIONS; SN-BASED SOLDERS; SOLDER JOINTS;

DETERIORATION; ELECTROMIGRATION; ELECTRONICS INDUSTRY; EUTECTICS; PHASE INTERFACES; SOLDERING ALLOYS;

TIN;

EID: 72549095324 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0944-7 Document Type: Article

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.