Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition

Journal of Alloys and Compounds

Volumn 479, Issue 1-2, 2009, Pages 505-510

  Zhang, X F ^a   Guo, J D ^a   Shang, J K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Electroless Ni P; Interfacial reaction; Intermetallic compound; Tin; Zn addition

Indexed keywords

CONSUMPTION RATES; ELECTROLESS NI-P; INTERFACIAL REACTION; INTERMETALLIC COMPOUND; LATTICE PARAMETERS; REACTION PRODUCTS; REACTIVE SPECIES; SUB LATTICES; TERNARY INTERMETALLIC COMPOUNDS; VEGARD'S LAWS; ZN ADDITION; ZN ATOMS; ZN CONTENTS;

ADDITION REACTIONS; BRAZING; NICKEL; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TITANIUM COMPOUNDS; WELDING; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN;

EID: 67349232381     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.12.093     Document Type: Article

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