Fatigue crack initiation and growth in solder alloys

Fatigue and Fracture of Engineering Materials and Structures

Volumn 30, Issue 5, 2007, Pages 443-457

  Kanchanomai, C ^a   Mutoh, Y ^b  

^a THAMMASAT UNIVERSITY   (Thailand)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Fatigue crack growth; Fatigue crack initiation; Lead free; Low cycle fatigue; Solder

Indexed keywords

CRACK INITIATION; ELECTRONICS PACKAGING; FATIGUE CRACK PROPAGATION; MATHEMATICAL MODELS; MELTING POINT; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; YIELD STRESS;

LEAD-FREE SOLDERS; LOW CYCLE FATIGUE;

SOLDERING ALLOYS;

EID: 34247570985     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2006.01088.x     Document Type: Article

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