A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 146-154

  Song, Fubin ^a   Lo, Jeffery C C ^a   Lam, Jimmy K S ^a   Jiang, Tong ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING TESTS; BRAZING; COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ENVIRONMENTAL REGULATIONS; METALLIC COMPOUNDS; ORES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY ANALYSIS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; WELDING;

ELECTRONIC COMPONENTS; LEAD-FREE SOLDER JOINTS; LEAD-FREE SOLDERING;

LEAD;

EID: 51349138944     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549961     Document Type: Conference Paper

References (12)

1. J. H. Lau, C. P. Wong, N. C. Lee and S. W. R. Lee, Electronics Manufacturing with Lead-free, Halogen-free and Conductive-adhesive materials, McGraw-Hill, New York, NY, (2003).
2. R. R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New York, NY, (2001).
3. J. Bath, C. Handwerker and E. Bradley, "Research Update: Lead-Free Solder Alternatives," Circuits Assembly, 11, (2000), pp. 45-52.
4. C. H. Chen, W. Wong, J. C. C. Lo, F. Song, S. W. R. Lee, "Characterization and Comparison of Five SAC-based Solder Pastes for Pb-free Reflow Soldering," Proc. 2007 International Symposium on High Density Packaging & Microsystem Integration (HDP'07), Shanghai, China, 26-28 June 2007, pp. 1-8.
5. 3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu," JOM : Journal of the Minerals, Metals & Materials Society, 55(6), June (2003), pp. 61-65.
6. rd Electronic Components & Technology Conference, New Orleans, LA, May 2003, pp. 64-70.
7. F. B. Song and S. W. R. Lee, "Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-free Solder Alloy," Proc. ASME International Mechanical Engineering Congress & Exhibitions, Orlando, FL, November 2005.
8. th Electronic Components & Technology Conference, San Diego, CA, June 2006, pp. 1196-1203.
9. JEDEC Standard JESD22-A104C, "Temperature Cycling," May 2005.
10. th Electronic Components & Technology Conference, Reno, NV, June 2007, pp. 962-967.
11. JEDEC Standard IPC/JEEDC-9702, "Monotonie Bend Characterization of Board-Level Interconnects," June 2004.
12. JEDEC Standard JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products," July 2003.