SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 10, 2005, Pages 693-700

Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures

(4) Erinc M a Schreurs, P J a Zhang, G Q b Geers, M G a

a EINDHOVEN UNIVERSITY OF TECHNOLOGY (Netherlands)

b NXP SEMICONDUCTORS (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ENERGY DISPERSIVE SPECTROSCOPY; INDENTATION; MECHANICAL PROPERTIES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS;

MECHANICAL CHARACTERIZATION; MICROSTRUCTURAL DAMAGE ANALYSIS; NANOINDENTATION;

TIN ALLOYS;

EID: 27244460240 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-005-3748-4 Document Type: Article

Times cited : (25)

References (21)

1
- 22144436685
- 10.1007/s10854-005-1147-5
- C. LING and D. CHU, J. Mater. Sci: Mater. El. 16 (2005) 355. 10.1007/ s10854-005-1147-5
- (2005) J. Mater. Sci.: Mater. El. , vol.16 , pp. 355
- Ling, C.¹ Chu, D.²

2
- 3142680352
- 10.1557/JMR.2004.0190
- L. A. ALLEN, M. R. NOTIS, R. R. CHROMIK and R. P. VINCI, J. Mater. Res. 19 (2004) 1417. 10.1557/JMR.2004.0190
- (2004) J. Mater. Res. , vol.19 , pp. 1417
- Allen, L.A.¹ Notis, M.R.² Chromik, R.R.³ Vinci, R.P.⁴

3
- 27244436844
- France
- M. A. MATIN, W. P. VELLINGA and M. G. D. GEERS, in Proceedings of EuroSimE, Aix-en-Provence, France (2003).
- (2003) Proceedings of EuroSimE, Aix-en-Provence
- Matin, M.A.¹ Vellinga, W.P.² Geers, M.G.D.³

4
- 0033747819
- 10.1016/S0927-796X(00)00010-3
- M. ABTEW and G. SELDAVURAY, Mater. Sci. Eng. 27 (2000) 95. 10.1016/ S0927-796X(00)00010-3
- (2000) Mater. Sci. Eng. , vol.27 , pp. 95
- Abtew, M.¹ Seldavuray, G.²

5
- 15944408791
- 10.1016/j.msea.2005.02.008
- W. C. LUO, C. E. HO, J. Y. TSAI, Y. L. LIN and C. R. KAO, Mater. Sci. Eng. A 396 (2005) 385. 10.1016/j.msea.2005.02.008
- (2005) Mater. Sci. Eng. A , vol.396 , pp. 385
- Luo, W.C.¹ Ho, C.E.² Tsai, J.Y.³ Lin, Y.L.⁴ Kao, C.R.⁵

6
- 85083081135
- P. L. LIU and J. K. SHANG, Mater. Trans. A 31 (2000) 2867.
- (2000) Mater. Trans. A , vol.31 , pp. 2867
- Liu, P.L.¹ Shang, J.K.²

7
- 0035248339
- 10.1109/6040.909621
- Y. C. CHAN, P. L. TU, C. W. TANG, K. C. HUNG and K. L. LAI, IEEE Trans. Adv. Pack. 24 (2001) 25. 10.1109/6040.909621
- (2001) IEEE Trans. Adv. Pack. , vol.24 , pp. 25
- Chan, Y.C.¹ Tu, P.L.² Tang, C.W.³ Hung, K.C.⁴ Lai, K.L.⁵

8
- 0000741863
- 10.1063/1.371967
- C. Y. LIU, K. N. TU, T. T. SHENG, C. H. TUNG, D. R. FREAR and P. ELENIUS, J. Appl. Phys. 87 (2000) 750. 10.1063/1.371967
- (2000) J. Appl. Phys. , vol.87 , pp. 750
- Liu, C.Y.¹ Tu, K.N.² Sheng, T.T.³ Tung, C.H.⁴ Frear, D.R.⁵ Elenius, P.⁶

9
- 0036665776
- 10.1109/TEPM.2002.801648
- K. ZENG, V. VUORINEN and J. K. KIVILAHTI, IEEE Trans. Elec. Pack. Manuf. 25 (2002) 162. 10.1109/TEPM.2002.801648
- (2002) IEEE Trans. Elec. Pack. Manuf. , vol.25 , pp. 162
- Zeng, K.¹ Vuorinen, V.² Kivilahti, J.K.³

10
- 0036648147
- M. LI, F. ZHANG, W. T. CHEN, K. ZENG, K. N. TU, H. BALKAN and P. ELENIUS, J. Mater. Res. 17 (2001) 1612.
- (2001) J. Mater. Res. , vol.17 , pp. 1612
- Li, M.¹ Zhang, F.² Chen, W.T.³ Zeng, K.⁴ Tu, K.N.⁵ Balkan, H.⁶ Elenius, P.⁷

11
- 2342545433
- 10.1109/TDMR.2004.827340
- P. RATCHEV, B. VANDEVELDE and I. DEWOLF, IEEE Trans. Dev. Mater. Rel. 4 (2004) 1. 10.1109/TDMR.2004.827340
- (2004) IEEE Trans. Dev. Mater. Rel. , vol.4 , pp. 1
- Ratchev, P.¹ Vandevelde, B.² Dewolf, I.³

12
- 0142137826
- 10.1016/S0921-5093(03)00277-6
- H. T. LEE, M. H. CHEN, H. M. JAO and T. L. LIAO, Mater. Sci. Eng. A 358 (2003) 134. 10.1016/S0921-5093(03)00277-6
- (2003) Mater. Sci. Eng. A , vol.358 , pp. 134
- Lee, H.T.¹ Chen, M.H.² Jao, H.M.³ Liao, T.L.⁴

13
- 11244336699
- 10.1016/j.msea.2004.10.007
- D. LI, C. LIU and P. P. CONWAY, Mater. Sci. Eng. A 391 (2005) 95. 10.1016/j.msea.2004.10.007
- (2005) Mater. Sci. Eng. A , vol.391 , pp. 95
- Li, D.¹ Liu, C.² Conway, P.P.³

14
- 4544270287
- 10.1016/j.microrel.2004.07.011
- M. ERINC, P. J. G. SCHREURS, G. Q. ZHANG and M. G. D. GEERS, Microelectr. Rel. 44 (2004) 1287. 10.1016/j.microrel.2004.07.011
- (2004) Microelectr. Rel. , vol.44 , pp. 1287
- Erinc, M.¹ Schreurs, P.J.G.² Zhang, G.Q.³ Geers, M.G.D.⁴

15
- 3242705835
- 10.1016/j.actamat.2004.05.046
- X. DENG, N. CHAWLA, K. K. CHAWLA and M. KOOPMAN, Acta Mater. 52 (2004) 4291. 10.1016/j.actamat.2004.05.046
- (2004) Acta Mater. , vol.52 , pp. 4291
- Deng, X.¹ Chawla, N.² Chawla, K.K.³ Koopman, M.⁴

16
- 0038768428
- R. R. CHROMIK, R. P. VINCI, S. L. ALLEN and M. R. NOTIS, J. Mater. Res. 18 (2003) 2251.
- (2003) J. Mater. Res. , vol.18 , pp. 2251
- Chromik, R.R.¹ Vinci, R.P.² Allen, S.L.³ Notis, M.R.⁴

17
- 27244444650
- H. RHEE, J. P. LUCAS and K. N. SUBRAMANIAN, J. Mater. Sci: Mater. El. 18 (2003) 2251.
- (2003) J. Mater. Sci.: Mater. El. , vol.18 , pp. 2251
- Rhee, H.¹ Lucas, J.P.² Subramanian, K.N.³

18
- 27244448056
- H. LIU, C. BASARAN, A. N. CARTWRIGHT and W. CASEY, IEEE Trans. Pack. Tech. 13 (8)(20024) 477.
- (2002) IEEE Trans. Pack. Tech. , vol.13 , Issue.8 , pp. 477
- Liu, H.¹ Basaran, C.² Cartwright, A.N.³ Casey, W.⁴

19
- 0034314437
- E. A. STOUT, N. R. SOTTOS and A. F. SKIPOR, IEEE Trans. Adv. Pack. 23 (4) (2000).
- (2000) IEEE Trans. Adv. Pack. , vol.23 , Issue.4
- Stout, E.A.¹ Sottos, N.R.² Skipor, A.F.³

20
- 0034316248
- E. S. DREXLER, IEEE Trans. Adv. Pack. 23 (4) (2000).
- (2000) IEEE Trans. Adv. Pack. , vol.23 , Issue.4
- Drexler, E.S.¹

21
- 0026875935
- W. C. OLIVER and G. M. PHARR, J. Mater. Res. 7 (6) (1992).
- (1992) J. Mater. Res. , vol.7 , Issue.6
- Oliver, W.C.¹ Pharr, G.M.²

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