Temperature-aware delay borrowing for energy-efficient low-voltage link design

NOCS 2010 - The 4th ACM/IEEE International Symposium on Networks-on-Chip

Volumn , Issue , 2010, Pages 107-114

  Wolpert, David ^a   Fu, Bo ^a   Ampadu, Paul ^a  

^a University of Rochester   (United States)

Author keywords

Delay borrowing; Energy efficient; Interconnect; Low voltage; Temperature

Indexed keywords

65NM TECHNOLOGY; DELAY VARIATION; ENERGY SAVING; ENERGY-EFFICIENT; ENVIRONMENTAL VARIATIONS; FREQUENCY VARIATION; LINK DESIGN; LOW VOLTAGES; LOW-VOLTAGE; SYSTEM TEMPERATURE; TEMPERATURE AWARE; TEMPERATURE DEPENDENCE; TEMPERATURE-INDUCED;

ENERGY CONSERVATION; MICROPROCESSOR CHIPS;

TRANSCEIVERS;

EID: 77955121837     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NOCS.2010.20     Document Type: Conference Paper

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