Temperature-aware placement for SOCs

Proceedings of the IEEE

Volumn 94, Issue 8, 2006, Pages 1502-1517

  Tsai, Jeng Llang ^b   Chen, Charlie Chung Ping ^a,c   Chen, Guoqiang ^d   Goplen, Brent ^d   Qian, Haifeng ^d   Zhan, Yong ^d   Kang, Sung Mo ^e   Wong, Martin D F ^a,f   Sapatnekar, Sachin S ^a,d  

^a IEEE   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^d UNIVERSITY OF MINNESOTA   (United States)

^e UNIVERSITY OF CALIFORNIA   (United States)

^f UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Physical design; Placement; Thermal analysis; Thermal simulation

Indexed keywords

COMPUTER SIMULATION; ELECTRIC POWER UTILIZATION; FAILURE (MECHANICAL); INTEGRATION; SIMULATED ANNEALING; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

PARTITION-DRIVEN; PHYSICAL DESIGN; THERMAL SIMULATION; THERMAL-AWARE PLACEMENT ALGORITHMS;

EMBEDDED SYSTEMS;

EID: 33947226035     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2006.879804     Document Type: Article

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