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Volumn 26, Issue 1, 2006, Pages 130-139

Temperature-aware on-chip networks

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; COMPUTER SIMULATION; COMPUTER SYSTEMS; DISTRIBUTED COMPUTER SYSTEMS; THERMAL EFFECTS; THERMOANALYSIS;

EID: 33644887130     PISSN: 02721732     EISSN: None     Source Type: Journal    
DOI: 10.1109/MM.2006.23     Document Type: Article
Times cited : (28)

References (15)
  • 1
    • 27544457181 scopus 로고    scopus 로고
    • "Exploiting Structural Duplication for Lifetime Reliability Enhancement"
    • IEEE CS Press
    • J. Srinivasan et al., "Exploiting Structural Duplication for Lifetime Reliability Enhancement," Proc. Int'l Symp. Computer Architecture (ISCA 05), IEEE CS Press, 2005, pp. 520-531.
    • (2005) Proc. Int'l Symp. Computer Architecture (ISCA 05) , pp. 520-531
    • Srinivasan, J.1
  • 4
    • 0034848112 scopus 로고    scopus 로고
    • "Route Packets Not Wires: On-Chip Interconnection Networks"
    • IEEE CS Press
    • W.J. Dally and B. Towles, "Route Packets, Not Wires: On-Chip Interconnection Networks," Proc. 38th Design Automation Conf. (DAC 01), IEEE CS Press, 2001, pp. 684-689.
    • (2001) Proc. 38th Design Automation Conf. (DAC 01) , pp. 684-689
    • Dally, W.J.1    Towles, B.2
  • 5
    • 0037669851 scopus 로고    scopus 로고
    • "Exploiting ILP, TLP, and DLP with the Polymorphous TRIPS Architecture"
    • IEEE CS Press
    • K. Sankaralingam et al., "Exploiting ILP, TLP, and DLP with the Polymorphous TRIPS Architecture," Proc. Int'l Symp. Computer Architecture (ISCA 03), IEEE CS Press, 2003, pp. 422-433.
    • (2003) Proc. Int'l Symp. Computer Architecture (ISCA 03) , pp. 422-433
    • Sankaralingam, K.1
  • 6
    • 0036505033 scopus 로고    scopus 로고
    • "The RAW Microprocessor: A Computational Fabric for Software Circuits and General-Purpose Programs"
    • Mar.-Apr
    • M.B. Taylor et al., "The RAW Microprocessor: A Computational Fabric for Software Circuits and General-Purpose Programs," IEEE Micro, vol. 22, no. 2, Mar.-Apr. 2002, pp. 25-35.
    • (2002) IEEE Micro , vol.22 , Issue.2 , pp. 25-35
    • Taylor, M.B.1
  • 7
    • 0036149420 scopus 로고    scopus 로고
    • "Networks on Chips: A New SoC Paradigm"
    • Jan
    • L. Benini and G. De Micheli, "Networks on Chips: A New SoC Paradigm," Computer, vol. 35, no. 1, Jan. 2002, pp. 70-78.
    • (2002) Computer , vol.35 , Issue.1 , pp. 70-78
    • Benini, L.1    De Micheli, G.2
  • 8
    • 84948976085 scopus 로고    scopus 로고
    • "Orion: A Power-Performance Simulator for Interconnection Networks"
    • IEEE CS Press
    • H.-S. Wang et al., "Orion: A Power-Performance Simulator for Interconnection Networks," Proc. 35th Int'l Symp. Microarchitecture (Micro-35), IEEE CS Press, 2002, pp. 294-305.
    • (2002) Proc. 35th Int'l Symp. Microarchitecture (Micro-35) , pp. 294-305
    • Wang, H.-S.1
  • 9
    • 0342815702 scopus 로고    scopus 로고
    • "Properly Implementing Thermal Spreading Will Cut Cost While Improving Device Reliability"
    • Int'l Soc. Optical Engineering (SPIE)
    • N.B. Nguyen, "Properly Implementing Thermal Spreading Will Cut Cost While Improving Device Reliability," Proc. Int'l Symp. Microelectronics, vol. 2920, Int'l Soc. Optical Engineering (SPIE), 1996, pp. 383-386.
    • (1996) Proc. Int'l Symp. Microelectronics , vol.2920 , pp. 383-386
    • Nguyen, N.B.1
  • 10
    • 0042727164 scopus 로고
    • "Fundamentals of Heat Transfer in a Multilayer System"
    • Jan
    • D. Meeks, "Fundamentals of Heat Transfer in a Multilayer System," Microwave J., vol. 1, no. 1, Jan. 1992, pp. 165-172.
    • (1992) Microwave J. , vol.1 , Issue.1 , pp. 165-172
    • Meeks, D.1
  • 11
    • 0002128489 scopus 로고
    • "Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition"
    • Amer. Soc. Mechanical Engineers
    • S. Song, S. Lee, and V. Au, "Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition," Proc. Int'l Electronics Packaging Conf., Amer. Soc. Mechanical Engineers, 1994, pp. 111-121.
    • (1994) Proc. Int'l Electronics Packaging Conf. , pp. 111-121
    • Song, S.1    Lee, S.2    Au, V.3
  • 14
    • 0036160813 scopus 로고    scopus 로고
    • "Analytical Thermal Model for Multilevel VLSI Interconnects Incorporating Via Effect"
    • Jan
    • T.Y. Chiang, K. Banerjee, and K.C. Saraswat, "Analytical Thermal Model for Multilevel VLSI Interconnects Incorporating Via Effect," IEEE Electron Device Letters, vol. 23, no. 1, Jan. 2002, pp. 31-33.
    • (2002) IEEE Electron Device Letters , vol.23 , Issue.1 , pp. 31-33
    • Chiang, T.Y.1    Banerjee, K.2    Saraswat, K.C.3
  • 15
    • 85008036915 scopus 로고    scopus 로고
    • "Migration in Single-Chip Multiprocessors"
    • K.A. Shaw and W.J. Dally, "Migration in Single-Chip Multiprocessors," Computer Architecture Letters, vol. 1, 2002; http://www.cs.virginia.edu/~tcca/2002paps.html.
    • (2002) Computer Architecture Letters , vol.1
    • Shaw, K.A.1    Dally, W.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.